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Diamond Wire and Diamond Wire Saws can cut most materials.
Diamond Wire Cutting is most effective to those looking
for
a precise, parallel and burr free cut. The kerf of Diamond
Wire cutting is usually .001 over the diameter of the
wire
size, therefore, Diamond wire is the best choice when cutting
material that is very expensive.
Below is a sample of products that are being sectioned today.
The times are an average. For many of the materials we have
additional information, such as the model used and further
analysis on the subject. If you would like us to perform
a
cutting analysis on your material please contact us information@diamondwiretech.com
or use the online application
information form or call us at 1-719-570-1150 x 18 in
the United States.
| Material |
Size |
Type of Cut |
Cutting Conditions |
Saw Used |
Quality |
Time |
Pics/Add'l Info |
| CZT |
5" diameter |
Slicing Multi-Wire |
Water |
Reel to Reel |
Parallel
+/-.001 |
120 Minutes |
Pics/Add'l
Info |
| Cesium Iodine |
4' x 4" x 12" |
Block |
Dry |
Std Dicer |
Square within .1mm |
5 seconds,
8 seconds |
|
| Cr3N5 |
4" x 6" |
Slice 1mm |
Surfactant |
Tangential Slicer |
Parallel
+/-.001mm |
90 Min. |
|
| ItO |
200mm x 200mm |
Slice .025" |
Surfactant |
Tangential Reel to Reel Slicer |
Flatness within 15 microns |
125 Min. |
|
| LiTaO3 |
4" diameter
|
.5mm |
Surfactant |
Tangential Reel to Reel |
10 Micron Flatness |
18 Min. |
|
| NiAl |
6" diameter |
Slice .25" |
Surfactant |
Tangential Capstan |
30-40 Micron |
90 Min |
|
| NiP20 |
at 4" diameter |
Slice 2mm |
Surfactant |
Tangential Capstan |
Flatness 20-25 Micron |
100 Min |
|
| Photonics Dicing |
2" x 2" |
Dice 220 Micron |
Dry |
Capstan Dicer |
parallel
+/- .0001" |
10 Min. |
Pics/Add'l
Info |
| PZT Ceramic |
1" Diameter |
.24" thick Sliced to .3" |
Dry |
Tangential Capstan Slicer |
TTV .001" |
30 Min. |
|
| Sapphire |
2" Diameter |
Sliced to .5mm |
Surfactant |
Tangential Multi Wire |
Surface Finish less than 3 Micron |
6 Hours |
Pics/Add'l
Info |
| SiC |
2" Diameter |
Sliced to 1mm |
Surfactant |
Tangential Multi Wire |
TTV .001", Surface Finish
less than 6 Micron |
7 Hours |
Pics/Add'l
Info |
|
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